NESG270034中文资料
NPN SILICON GERMANIUM RF TRANSISTOR
NESG270034
NPN SiGe RF TRANSISTOR FOR
MEDIUM OUTPUT POWER AMPLIFICATION (2 W)
3-PIN POWER MINIMOLD (34 PKG)
FEATURES
This product is suitable for medium output power (2 W) amplification Pout = 33.5 dBm TYP. @ VCE = 6 V, Pin = 20 dBm, f = 460 MHz Pout = 31.5 dBm TYP. @ VCE = 6 V, Pin = 20 dBm, f = 900 MHz
Using UHS2-HV process (SiGe technology), VCBO (ABSOLUTE MAXIMUM RATINGS) = 25 V 3-pin power minimold (34 PKG)
ORDERING INFORMATION
Part Number NESG270034
Order Number NESG270034-AZ
Package
3-pin power minimold (34 PKG) (Pb-Free)
2
Note1,
Quantity 25 pcs (Non reel) 1 kpcs/reel
Supplying Form
Magazine case
NESG270034-T1 NESG270034-T1-AZ 12 mm wide embossed taping
Pin 2 (Emitter) face the perforation side of the tape
Notes 1. Contains Lead in the part except the electrode terminals.
2. With regards to terminal solder (the solder contains lead) plated products (conventionally plated), contact
your nearby sales office.
Remark To order evaluation samples, contact your nearby sales office.
Unit sample quantity is 25 pcs.
ABSOLUTE MAXIMUM RATINGS (TA = +25°C)
Collector to Base Voltage Collector to Emitter Voltage Emitter to Base Voltage Collector Current Total Power Dissipation Junction Temperature Storage Temperature
V
CBOVCEOVEBOICPtot
Note
Tj°C Tstg
65 to +150
°C
2
Note Mounted on 34.2 cm × 0.8 mm (t) glass epoxy PWB
CautionObserve precautions when handling because these devices are sensitive to electrostatic discharge.
Document No. PU10577EJ01V0DS (1st edition) Date Published September 2005 CP(K)
© NEC Compound Semiconductor Devices, Ltd. 2005
THERMAL RESISTANCE (TA = +25°C)
Termal Resistance from Junction to Ambient
Note
Rthj-a°C/W
Note Mounted on 34.2 cm × 0.8 mm (t) glass epoxy PWB
2
RECOMMENDED OPERATING RANGE (TA = +25°C)
Collector to Emitter Voltage Collector Current Input Power
Note
VCE IC Pin
Note Input power under conditions of VCE ≤ 6.0 V, f = 460 MHz
2
Preliminary Data Sheet PU10577EJ01V0DS
ELECTRICAL CHARACTERISTICS (TA = +25°C)
Test DC Characteristics Collector Cut-off Current Emitter Cut-off Current DC Current Gain
RF Characteristics Linner Gain (1) Linner Gain (2)
ICBO IEBO hFE
Note
80
120
1 1 180
VCB = 9.2 V, IE = 0 mA VEB = 1.0 V, IC = 0 mA VCE = 3 V, IC = 100 mA
µA µA
GL
VCE = 6 V, IC (set) = 30 mA (RF OFF), f = 460 MHz, Pin = 0 dBm
GL Pout Pout
VCE = 6 V, IC (set) = 30 mA (RF OFF), f = 900 MHz, Pin = 0 dBm
VCE = 6 V, IC (set) = 30 mA (RF OFF), f = 460 MHz, Pin = 20 dBm
VCE = 6 V, IC (set) = 30 mA (RF OFF), f = 900 MHz, Pin = 20 dBm
VCE = 6 V, IC (set) = 30 mA (RF OFF), f = 460 MHz, Pin = 20 dBm
VCE = 6 V, IC (set) = 30 mA (RF OFF), f = 900 MHz, Pin = 25 dBm
dB
15 dB dBm dBm % %
Output Power (1) Output Power (2) Collector Efficiency (1) Collector Efficiency (2)
31.5 60 50
ηC ηC
Note Pulse measurement: PW ≤ 350 µs, Duty Cycle ≤ 2%
hFE CLASSIFICATION
hFE Value
80 to 180
Preliminary Data Sheet PU10577EJ01V0DS
3
NESG270034
TYPICAL CHARACTERISTICS (TA = +25°C, unless otherwise specified)
TOTAL POWER DISSIPATIONvs. AMBIENT TEMPERATURE
Total Power Dissipation Ptot (mW)
Ambient Temperature TA ( C)
Remark The graph indicates nominal characteristics.
4
Preliminary Data Sheet PU10577EJ01V0DS
NESG270034
S-PARAMETERS
S-parameters/Noise parameters are provided on the NEC Compound Semiconductor Devices Web site in a form (S2P) that enables direct import to a microwave circuit simulator without keyboard input.Click here to download S-parameters. [RF and Microwave] → [Device Parameters]URL http://doc.guandang.net/
PA EVALUATION CIRCUIT TYPICAL CHARACTERISTICS
OUTPUT POWER, COLLECTOR
CURRENT, COLLECTOR EFFICIENCY vs. INPUT POWER
)
)
m,)A%B(m dC(( ηtu oCI yP ct nn reeeirrcwiufoCfPE rrtuoottpcctueellllOooCCInput Power Pin (dBm)
Remark The graph indicates nominal characteristics.
Preliminary Data Sheet PU10577EJ01V0DS
5
NESG270034
EVALUATION CIRCUIT (f = 460 MHz)
RF IN
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
EVALUATION BOARD (f = 460 MHz)
GNDVBE
VCE
GND
Notes
1. 38 × 38 mm, t = 0.8 mm double sided copper clad glass epoxy PWB. 2. Back side: GND pattern 3. Solder gold plated on pattern 6
Preliminary Data Sheet PU10577EJ01V0DS
COMPONENT LIST
Size Purpose
C1 Murata 11 pF 1005 Input DC Block/Input RF Matching C2 Murata 9.5 pF 1005 Input RF Matching
C3 Murata 39 pF 1005 Input DC Block/Output RF Matching C4 Murata 10 000 pF 1005 RF GND C5 Murata 10 000 pF 1005 RF GND
L1 Toko 390 nH 2012 RF Block/Input RF Matching L2 Toko 47 nH 1608 RF Block/Output RF Matching L3 Toko 5.6 nH 2012 Input RF Matching L4
Toko
5.1 nH
1608
Output RF Matching
Improve Stability Improve Stability
Preliminary Data Sheet PU10577EJ01V0DS
7
PACKAGE DIMENSIONS
3-PIN POWER MINIMOLD (34 PKG) (UNIT: mm)
8
PIN CONNECTIONS
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