Sn_Cu_Ni焊点纳米压痕试验分析(2)
nanocrystallineZnO[J].JournalofMaterialsResearch,1992,7(4):973-979.
[4]GaoF,NishikawaH,TakemotoT,etal.Mechanicalproperties
versustemperaturerelationofindividualphasesinSn-3.0Ag-0.5Culead-freesolderalloy[J].MicroelectronicsReliability,2009,49(3):296-302.
[5]ChromikRR,VinciRP,AllenSL,etal.Measuringtheme-chanicalpropertiesofPb-freesolderandSn-basedintermetallicsJ].JournaloftheMinerals,MetalsandMate-bynanoindentation[
2003,55(6):66-69.rialsSociety,
[6]DudekMA,ChawlaN.Nanoindentationofrareearth-Sninterme-
图6Fig.6
钎料基体蠕变应变速率—压痕硬度关系图
tallicsinPb-freesolders[J].Intermetallics,2010,18(5):1016-1020.
[7]ChandraRaoBSS,WengJ,ShenL,etal.Morphologyandme-chanicalpropertiesofintermetalliccompoundsinSnAgCusolderJ].MicroelectronicEngineering,2010,87(11):2416-joints[2422.
[8]王凤江,钱乙余,马
775-779.
WangFengjiang,QianYiyu,MaXin.MeasurementofmechanicalpropertiesofSn-Ag-CubulksolderBGAsolderjointusingnanoin-J].ActaMetallrugicaSinica,2005,41(7):775-779.dentation[
Ag-Cu无铅钎鑫.纳米压痕法测量Sn-.金属学报,2005,41(7):料BGA焊点的力学性能参数[J]
Relationofcreepstrainrateandhardnessofsold-eralloy
Sn-Pb钎料是由富锡相+富铅相构成的固溶
Cu-Ni钎料的显微组织是由富锡相+金属体,而Sn-细小的金属间化合物颗粒硬度较高,间化合物构成,
弥散分布于钎料中,能够阻碍位错的滑移,使得抗蠕
变性能有较大的提高.但粗大的金属间化合物由于力学性能参量与钎料基体有较大的差异,因此对整个焊点的力学性能将起到负面作用.
微量Ce元素可聚集在表面、界面处,有效降低界面能,阻碍晶界滑动,因此对焊点抗蠕变性能具有显著改善作用,试验结果表明添加Ce元素可有效
作者简介:
@126.com
1981年出生,王俭辛,男,博士,讲师.主要研究方向
为无铅钎料及微电子焊接技术.发表论文10篇.Email:wangjx_just
Ⅳ
MAINTOPICS,ABSTRACTS&KEYWORDS2011,Vol.32,No.12
Throughcomparingthesimulationresultsandexperimentalmeas-urements,thepredictionaccuracyofthedevelopedthermo-elas-tic-plasticFEMbasedonQuickWelderwasverified.Mean-while,theinfluenceofweldingsequenceontheresidualstress
distributionwasclarifiedusingnumericalsimulationmethod.Theresultsshowthatbothtransverseresidualstressandlongitudinalresidualstressweresignificantlyaffectedbydepositionsequence.Thedepositionsequencenotonlylargelychangesthepeakvaluesofresidualstress,butalsoalterstheshapeofresidualstressdis-tribution.
Keywords:numericalsimulation;non-linearanalysis;weldingresidualstress;weldingsequence
NanoindentationmeasurementofSn-Cu-NijointWANG
Jianxin,LAIZhongmin,SUNDandan(ProvinceKeyLabofAd-vancedWeldingTechnology,JiangsuUniversityofScienceandTechnology,Zhenjiang212003,China).p59-62
Abstract:Inordertostudytheeffectofintermetalliccompoundonmechanicalpropertiesofjoint,theelasticmodulusandhardnessofintermetalliccompoundswereanalyzedbynanoindentationmethod,andthecreepstrainratesensitivityofsoldermatrixwasobtainedbyMayo-Nixmethod.Fromthephysi-calanalysisofnanoindentationcurves,theelasticmoduluof(Cu,Ni)6Sn5inSn-Cu-Nijointsis113.2GPa±4.8GPa,
whilethehardnessis5.59GPa±0.32GPa.Itisfoundthatin-termetalliccompoundsarethekeyfactorsinthereliabilityoflead-freejoints,duetothebigcontrastsbetweenmechanicalpropertiesofintermetalliccompoundsandsoldermatrix.ThecreepstrainratesensitivitiesofSn-Cu-Ni,Sn-Cu-Ni-0.05Ceand
Sn-Pbsoldermatrixare0.1286,0.1248,and0.1832,andthecreepstressexponentsare7.7760,8.0128,and5.4585,re-spectively,whichindicatetheimprovementincreepresistanceofSn-Cu-NijointsduetoCeaddition.Keywords:lead-freesolder;nanoindentation;elasticmodulu;creepstrainratesensitivity
InterfacialmicrostructureofsinteringcompositesofPCBN
ZHANGBin,grains-graphiteparticles-CuSnTialloy
DINGWenfeng,XUJiuhua,CHENZhenzhen,SUHonghua,FUYucan(CollegeofMechanicalandElectricalEngineering,NanjingUniversityofAeronauticsandAstronautics,Nanjing
69210016,China).p63-65,
Abstract:SinteringexperimentsofCu-Sn-Tialloy,poly-crystallinecubicboronnitride(PCBN)abrasivegrainsandgraphiteparticleswerecarriedoutattheheatingtemperatureof920℃withthedwelltimeof30min.Thestrengthofsinteringbulkswasmeasuredbymeansofthethree-pointbendingexperi-ments.Theinterfacialmicrostructureandthephasesofthesinte-ringbulkswerecharacterizedusingscanningelectronmicroscope(SEM),energydispersionspectrometer(EDS)andX-raydif-fraction(XRD).Theresultsrevealthatinthecaseofthegraph-itecontentof5~15wt%,thebendingstrengthofthecompositebulksisabove91MPa,whichismuchhigherthanthatofthebulkstrengthofthevitrifiedgrindingwheels.Theelementaldif-fusionbehaviorhastakenplaceacrossthejoininginterfacebe-tweenPCBNgrainsandCu-Sn-Tialloyinthesinteringprocess.
Thecompoundswereformed,therefore,thePCBNgrainswerebondedfirmly.Undersuchcondition,thebreakageofthePCBNgrainshasplayedthemostimportantroleinthefractureofthecompositebulks.Inparticular,thebreakagemodeofthePCBN
grainsistheintergranularfracture.
Keywords:PCBNabrasivegrains;Cu-Sn-Tialloy;ben-dingstrength;interfacialmicrostructure
Finiteelementanalysisoftemperaturefieldduringkeyhole-plasmaarcweldingusingSYSWELDsoftwareHU
112
Qingxian,WANGYanhui,YAOQingjun,WANGShunyao1(1.ProvincialKeyLabofAdvancedWeldingTechnology,Jian-gsuUniversityofScienceandTechnology,Zhenjiang212003,China;2.JiangsuProvinceSpecialEquipmentSafetySupervi-sionInspectionInstitute,YangzhouBranch,Yangzhou225003,China).p66-69
Abstract:Consideringtheweldgeometriccharactersofkeyholeplasmaarcwelding(K-PAW),asuitableandadaptive
combinedheatsourcefornumericalsimulationisdeveloped,i.e.atthetransversecross-sectionandalongtheworkpiecethick-ellipsoidalvolumetricheatsourceactsnessdirection,thedouble-atupperpartoftheworkpiecewhilealinearly-increasedpeak
valueofheatfluxingaussiancylindermodeex …… 此处隐藏:5209字,全部文档内容请下载后查看。喜欢就下载吧 ……
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