美国大学生数学建模竞赛2013 获奖论文(4)

References[1]FranklinC.daSilva,AntBnioM.Soares,andLeonardoR.A.X.deMenezes.”NewAbsorbingBoundaryConditionsfortheFiniteDifferenceMethodbasedonDiscreteSolutionsofLaplaceEquation”.IeeeConferencePublications,2003

1037-1041.

美国大学生数学建模竞赛

[2]ZhangWenting,ChengJie,”Astudyofanalyzingtheheatdistributiononvaryingtypesofpansanditsoptimal“,20136thInternationalConferenceonInformationManagement,2013.

[3]LuoXuanCuiGuozhongLeFulong.2014.HeatDistributionMathematicalModelandNumericalSimulationofanElectricOven.Proceedingsofthe33rdChineseControlConferenceJuly28-30,2014,Nanjing,China.

[4]LeiHuang,ZhongLiu,ZhiLiu,”Animprovedlowest-levelbest-fitalgorithmwithmemoryforthe2Drectangularpackingproblem”,InformationScience,ElectronicsandElectricalEngineering(ISEEE),2014InternationalConferenceonVolume:2PublicationYear:2014,Page(s):1279–1282.

[5]Hoshi,F.,Murai,Y.,Tsuji,H.Tokumasu,S.“Anewdeterministicalgorithmfortwo-dimensionalrectangularpackingproblemsbasedonpolyominopacking

models”SystemsManandCybernetics(SMC),2010IEEEInternational

ConferenceonPublicationYear:2010,Page(s):2760-2766

[6]Zecova,M.,Terpak,J.,Dorcak,L.”Usageoftheheatconductionmodelfortheexperimentaldeterminationofthermaldiffusivity“CarpathianControlConference(ICCC),201314thInternationalPublicationYear:2013,Page(s):436-441

[7]Nakayama,W.“Heatconductionincompositesofthermallydissimilarmaterials-amethodologytoeconomizenumericalheattransferanalysisofelectronic

components“ElectronicsMaterialsandPackaging,2005.EMAP2005.

InternationalSymposiumonPublicationYear:2005,Page(s):282-287

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美国大学生数学建模竞赛

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