京瓷高耐电压mlcc贴片电容规格书(2)

Keepspecimenat150°C 0/ 10°Cforonehour,leavespecimenatroomambientfor48 4hours.Applythesametestconditionforonehour,thenleavethespecimenatroomambientfor48 4hours.

Multilayer Ceramic Chip CapacitorsPackaging Options

Reel

Tape

(Unit:mm)

W2:18.4mmmax.

F 2mm(03,05,105Type)

(Unit:mm)

(Unit:mm)

05Type:0.75max.105Type:1.1max.

F 4mm(105,D11,D12,F12,21,316,32,42,52Type)

(Plastic)

(Paper)

F 8mm(43,53,55Type)

(Plastic)

Multilayer Ceramic Chip CapacitorsPrecautions

CircuitDesign

1.Onceapplicationandassemblyenvironmentshavebeenchecked,eexceedingthatwhichisspecifiedmayresultininferiorperformanceorcauseashort,open,smoking,orflamingtooccur,etc.2.Pleaseconsultthemanufacturerinadvancewhenthecapacitorisusedindevicessuchas:deviceswhichdealwithhumanlife,i.e.medicaldevices;deviceswhicharehighlypublicorientated;anddeviceswhichdemandahighstandardofliability.

Accidentormalfunctionofdevicessuchasmedicaldevices,spaceequipmentanddeviceshavingtodowithatomicpowercouldgenerategraveconsequencewithrespecttohumanlivesor,possibly,aportionofthepublic.Capacitorsusedinthesedevicesmayrequirehighreliabilitydesigndifferentfromthatofgeneralpurposecapacitors.3.Pleaseusethecapacitorsinconformancewiththeoperatingtemperatureprovidedinboththecatalogandthespecifications.

Beespeciallycautiousnottoexceedthemaximumtemperature.Inthesituationthemaximumtemperaturesetforthinboththecatalogandspecificationsisexceeded,thecapacitor'sinsulationresistancemaydeteriorate,powermaysuddenlysurgeandshort-circuitmayoccur.

Thecapacitorhasaloss,andmayself-heatduetoequivalentseriesresistancewhenalternatingelectriccurrentispassedtherethrough.Asthiseffectbecomesespeciallypronouncedinhighfrequencycircuits,pleaseexercisecaution.

Whenusingthecapacitorina(self-heating)circuit,pleasemakesurethesurfaceofthecapacitorremainsunderthemaximumtemperatureforusage.Also,pleasemakecertaintemperaturerisesremainbelow20°C.4.Pleasekeepvoltageundertheratedvoltagewhichisappliedtothecapacitor.Also,pleasemakecertainthepeakvoltageremainsbelowtheratedvoltagewhenACvoltageissuper-imposedtotheDCvoltage.

InthesituationwhereACorpulsevoltageisemployed,ensureaveragepeakvoltagedoesnotexceedtheratedvoltage.

Exceedingtheratedvoltageprovidedinbothcatalogandspecificationsmayleadtodefectivewithstandingvoltageor,inworstcasesituations,maycausethecapacitortosmokeorflame.5.Whenthecapacitoristobeemployedinacircuitinwhichthereiscontinuousapplicationofahighfrequencyvoltageorasteeppulsevoltage,eventhoughitiswithintheratedvoltage,pleaseinquiretothemanufacturer.

InthesituationthecapacitoristobeemployedusingahighfrequencyACvoltageoraextremelyfastrisingpulsevoltage,eventhoughitiswithintheratedvoltage,itispossiblecapacitorreliabilitywilldeteriorate.6.Itisacommonphenomenonofhigh-dielectricproductstohaveadeterioratedamountofstaticelectricityduetotheapplicationofDCvoltage.Duecautionisnecessaryasthedegreeofdeteriorationvariesdependingonthequalityofcapacitormaterials,capacity,aswellastheloadvoltageatthetimeofoperation.7.Donotusethecapacitorinanenvironmentwhereitmighteasilyexceedtherespectiveprovisionsconcerningshockandvibrationspecifiedinthecatalogandspecifications.

Inaddition,itisacommonpiezophenomenonofhighdielectricproductstohavesomeVoltageduetovibrationortohavenoiseduetoVoltagechange.Pleasecontactsalesinsuchcase.8.Iftheelectrostaticcapacityvalueofthedeliveredcapacitoriswithinthespecifiedtolerance,pleaseconsiderthiswhendesigningtherespectiveproductinorderthattheassembledproductfunctionappropriately.9.Pleasecontactusuponusingconductiveadhesives.

Storage

1.Ifthecomponentisstoredinminimalpackaging(aheat-sealedorchuck-typeplasticbag),thebagshouldbekeptclosed.Oncethebaghasbeenopened,resealitorstoreitinadesiccator.2.Keepstorageplacetemperature+5to+35degreeC,humidity45to70%RH.

3.Thestorageatmospheremustbefreeofgascontainingsulfurandchlorine.Also,avoidexposingtheproducttosalinemoisture.Iftheproductisexposedtosuchatmospheres,theterminalswilloxidizeandsolderabilitywillbeeffected.4.Precautions1)-3)applytochipcapacitorspackagedincarriertapesandbulkcases.

5.Thesolderabilityisassuredfor12monthsfromourshippingdate(sixmonthsforsilverpalladium)iftheabovestorageprecautionsarefollowed.

6.Chipcapacitorsmaycrackifexposedtohydrogen(H2)gaswhilesealedorifcoatedwithsilicon,whichgenerateshydrogengas.

(Unit:mm)

Whenmountingthecapacitortothesubstrate,itisimportanttoconsidercarefullythattheamountofsolder(sizeoffillet)usedhasadirecteffectuponthecapacitoronceitismounted.

a)Thegreatertheamountofsolder,thegreaterthestresstotheelements.Asthismaycausethesubstratetobreakorcrack,itisimportanttoestablishtheappropriatedimensionswithregardtotheamountofsolderwhendesigningthelandofthesubstrate.b)Inthesituationwheretwoormoredevicesaremountedontoacommonland,separatethedeviceintoexclusivepadsbyusingsolderingresist

(Unit:mm)

Multilayer Ceramic Chip CapacitorsSurface Mounting Information

MountingDesign

ThechipcouldcrackifthePCBwarpsduringprocessingafterthechiphasbeensoldered.

RecommendedchippositiononPCBtominimizestressfromPCBwarpage

(Notrecommended)

(Ideal)

ActualMounting

1)Ifthepositionofthevacuumnozzleistoolow,alargeforcemaybeappliedtothechipcapacitorduringmounting,resultingincracking.2)Duringmounting,setthenozzlepressuretoastaticloadof100to300gf.

3)Tominimizetheshockofthevaccumnozzle,provideasupportpinonthebackofthePCBtominimizePCBflexture.

4)Bottompositionofpickupnozzleshouldbeadjustedtothetopsurfaceofasubstratewhichcamberiscorrected.5)Toreducethepossibilityofchippingandcracks,minimizevibrationtochipsstoredinabulkcase.

6)Thedischargepressuremustbeadjustedtothepartsize.Verifythepressureduringsetuptoavoidfracturingorcrackingthechipscapacitors.

ResinMold

1)Ifalargeamountofresinisusedformoldingthechip,cracksmayoccurduetocontractionstressduringcuri …… 此处隐藏：4848字，全部文档内容请下载后查看。喜欢就下载吧 ……