ZLLS350TA;中文规格书,Datasheet资料

40V LOW LEAKAGE SCHOTTKY DIODE

Features

Low VF 380mA continuous current rating Low profile SOD523 package Totally Lead-Free & Fully RoHS compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3) Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

Case: SOD523 Case Material: Molded Plastic, "Green" Molding Compound.

UL Flammability Classification Rating 94V-0 Moisture Sensitivity: Level 1 per J-STD-020 Terminal Connections: Cathode Band Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.

Solderable per MIL-STD-202, Method 208 Weight: 0.001 grams (approximate)

Description

Packaged in the SOD523 package offering an ideal low VF /IR

performance combined with a low package height making the device suitable for various converter, charger and LED driver circuits

Top View SOD523

Top View Pin-Out

Ordering Information (Note 4)

Part Number ZLLS350TA

Notes:

Case SOD523

Packaging 3000/Tape & Reel

1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See /quality/lead_free.html for more information about Diodes Incorporated’s definitions of Halogen and Antimony free, "Green" and Lead-Free. 

3. Halogen and Antimony free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.

4. For packaging details, go to our website at /datasheets/ap02007.pdf.

Marking Information

L3

L3 = Product Type Marking Code

ZLLS350

Document Number: DS33225 Rev. 5 - 2

1 of 4

April 2012

© Diodes Incorporated

Maximum Ratings @TA = 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load. For capacitance load, derate current by 20%.

DC Blocking Voltage VRM

Continuous Forward current IF

Average Peak Forward Current; duty cycle = 50% IFAV

Non-Repetitive Forward Current @ t < 100µs6.0

A IFSM

@ t < 10ms1.3

Power Dissipation at TA = 25°C (Note 5) PD

Power Dissipation at TA = 25°C (Note 6) PD

Operating and storage temperature range -55 to +150 °C TSTG

Junction Temperature TJ

Thermal Characteristics

Thermal Resistance Junction to Ambient (Note 5) 350 RJA

°C/W

Thermal Resistance Junction to Ambient (Note 6) 303 RJA

Electrical Characteristics @TA = 25°C unless otherwise specified

Reverse Breakdown Voltage V(BR)R Forward Voltage Drop (Note 7) Leakage Current Total Capacitance Reverse Recovery Time

Notes:

VF IR CTtrr

IR = 100 µA IF = 30mA IF = 50mA

V

IF = 100mA IF = 275mA VR = 30V f = 1MHz; VR = 30V

Switch from IF = 100mA to

IR = 100mA.

Measured at IR = 10mA

5. For a single device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of 1oz copper in still air conditions 6. As above measured at t < 5 seconds

7. Measured under pulsed conditions. Pulse width ≤ 300µs; duty cycle ≤ 2%

ZLLS350

Document Number: DS33225 Rev. 5 - 2

2 of 4

April 2012

© Diodes Incorporated

IR

, INSTANTANEOUS REVERSE CURRENT (µA)

IF, INSTANTANEOUS FORWARD CURRENT (A)

VR, INSTANTANEOUS REVERSE VOLTAGE (V)

Fig. 2 Typical Reverse Characteristics

VF, INSTANTANEOUS FORWARD VOLTAGE (V)

Fig. 1 Forward Characteristics

CT, TOTAL CAPACITANCE (pF)

0.4

PD, POWER DISSIPATION (W)

0.3

0.2

0.1

0.01

0.1110100VR, DC REVERSE VOLTAGE (V)

Fig. 3 Total Capacitance vs. Reverse Voltage

TA, AMBIENT TEMPERATURE (C)

Fig. 4 Power Dissipation vs. Ambient Temperature

Package Outline Dimensions

SOD523 Dim Min Max A 0.25 0.35 B 0.70 0.90 C 1.50 1.70

H 1.10

1.30 K 0.55 0.65 L 0.10 0.30 M All Dimensions in mm

ZLLS350

Document Number: DS33225 Rev. 5 - 2

3 of 4

April 2012

© Diodes Incorporated

Suggested Pad Layout

C

X

YGZ

DimensionsValue (in mm)

Z 2.3 G 1.1 X 0.8 Y 0.6 C 1.7

IMPORTANT NOTICE

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