CD4555BMG4中文资料

元器件交易网http://doc.guandang.net

Data sheet acquired from Harris Semiconductor SCHS087D Revised October 2003

The CD4555B and CD4556B types are supplied in 16-lead hermetic dual-in-line ceramic packages (F3A suffix), 16-lead dual-in-line plastics packages (E suffix), and 16-lead small-outline packages (M, M96, and MT suffixes). The CD4555B is also supplied in 16-lead small-outline packages (NSR suffix) and 16-lead thin shrink small-outline packages (PW and PWR suffixes.)

Copyright 2003, Texas Instruments Incorporated

元器件交易网http://doc.guandang.net

元器件交易网http://doc.guandang.net

元器件交易网http://doc.guandang.net

元器件交易网http://doc.guandang.net

PACKAGEOPTIONADDENDUM

http://doc.guandang.net

14-Oct-2008

PACKAGINGINFORMATION

OrderableDevice7704701EA7704801EACD4555BECD4555BEE4CD4555BF3ACD4555BMCD4555BM96CD4555BM96E4CD4555BM96G4CD4555BME4CD4555BMG4CD4555BMTCD4555BMTE4CD4555BMTG4CD4555BNSRCD4555BNSRE4CD4555BNSRG4CD4555BPWCD4555BPWE4CD4555BPWG4CD4555BPWRCD4555BPWRE4CD4555BPWRG4CD4556BECD4556BEE4CD4556BFCD4556BF3A

Status(1)ACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE

Package

TypeCDIPCDIPPDIPPDIPCDIPSOICSOICSOICSOICSOICSOICSOICSOICSOICSOSOSOTSSOPTSSOPTSSOPTSSOPTSSOPTSSOPPDIPPDIPCDIPCDIP

PackageDrawing

JJNNJDDDDDDDDDNSNSNSPWPWPWPWPWPWNNJJ

PinsPackageEcoPlan(2)

Qty161616161616161616161616161616161616161616161616161616

112525140

TBDTBDPb-Free(RoHS)Pb-Free(RoHS)TBDGreen(RoHS&noSb/Br)

Lead/BallFinishA42SNPBA42SNPBCUNIPDAUCUNIPDAUA42SNPBCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUA42SNPBA42SNPB

MSLPeakTemp(3)N/AforPkgTypeN/AforPkgTypeN/AforPkgTypeN/AforPkgTypeN/AforPkgTypeLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMN/AforPkgTypeN/AforPkgTypeN/AforPkgTypeN/AforPkgType

2500Green(RoHS&

noSb/Br)2500Green(RoHS&

noSb/Br)2500Green(RoHS&

noSb/Br)4040250250250

Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)

2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)909090

Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)

2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)2000Green(RoHS&

noSb/Br)252511

Pb-Free(RoHS)Pb-Free(RoHS)TBDTBD

元器件交易网http://doc.guandang.net

PACKAGEOPTIONADDENDUM

http://doc.guandang.net

14-Oct-2008

OrderableDeviceCD4556BF3AS2283

CD4556BMCD4556BM96CD4556BM96E4CD4556BM96G4CD4556BME4CD4556BMG4CD4556BMTCD4556BMTE4CD4556BMTG4

(1)

Status(1)OBSOLETEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVEACTIVE

PackageTypeCDIPSOICSOICSOICSOICSOICSOICSOICSOICSOIC

PackageDrawing

JDDDDDDDDD

PinsPackageEcoPlan(2)

Qty16161616161616161616

40

TBDGreen(RoHS&noSb/Br)

Lead/BallFinish

CallTICUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAUCUNIPDAU

MSLPeakTemp(3)CallTI

Level-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIMLevel-1-260C-UNLIM

2500Green(RoHS&

noSb/Br)2500Green(RoHS&

noSb/Br)2500Green(RoHS&

noSb/Br)4040250250250

Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)Green(RoHS&noSb/Br)

Themarketingstatusvaluesaredefinedasfollows:ACTIVE:Productdevicerecommendedfornewdesigns.

LIFEBUY:TIhasannouncedthatthedevicewillbediscontinued,andalifetime-buyperiodisineffect.

NRND:Notrecommendedfornewdesigns.Deviceisinproductiontosupportexistingcustomers,butTIdoesnotrecommendusingthispartinanewdesign.

PREVIEW:Devicehasbeenannouncedbutisnotinproduction.Samplesmayormaynotbeavailable.OBSOLETE:TIhasdiscontinuedtheproductionofthedevice.

(2)

EcoPlan-Theplannedeco-friendlyclassification:Pb-Free(RoHS),Pb-Free(RoHSExempt),orGreen(RoHS&noSb/Br)-pleasecheckhttp://doc.guandang.net/productcontentforthelatestavailabilityinformationandadditionalproductcontentdetails.TBD:ThePb-Free/Greenconversionplanhasnotbeendefined.

Pb-Free(RoHS):TI'sterms"Lead-Free"or"Pb-Free"meansemiconductorproductsthatarecompatiblewiththecurrentRoHSrequirementsforall6substances,includingtherequirementthatleadnotexceed0.1%byweightinhomogeneousmaterials.Wheredesignedtobesolderedathightemperatures,TIPb-Freeproductsaresuitablefor

useinspecifiedlead-freeprocesses.

Pb-Free(RoHSExempt):ThiscomponenthasaRoHSexemptionforeither1)lead-basedflip-chipsolderbumpsusedbetweenthedieandpackage,or2)lead-baseddieadhesiveusedbetweenthedieandleadframe.ThecomponentisotherwiseconsideredPb-Free(RoHScompatible)asdefinedabove.

Green(RoHS&noSb/Br):TIdefines"Green"tomeanPb-Free(RoHScompatible),andfreeofBromine(Br)andAntimony(Sb)basedflameretardants(BrorSbdonotexceed0.1%byweightinhomogeneousmaterial)

(3)

MSL,PeakTemp.--TheMoistureSensitivityLevelratingaccordingtotheJEDECindustrystandardclassifications,andpeaksoldertemperature.

ImportantInformationandDisclaimer:TheinformationprovidedonthispagerepresentsTI'sknowledgeandbeliefasofthedatethatitisprovided.TIbasesitsknowledgeandbeliefoninformationprovidedbythirdparties,andmakesnorepresentationorwarrantyastotheaccuracyofsuchinf …… 此处隐藏：9443字，全部文档内容请下载后查看。喜欢就下载吧 ……