A Scalable Substrate Noise Coupling Model for Mixed-Signal I
Abstract—A scalable macromodel for substrate noise coupling in heavily doped substrates has been developed. This model is simple since it requires only four parameters which can readily be extracted from a small number of device simulations or measurement
AScalableSubstrateNoiseCouplingModel
forMixed-SignalICs
KartiMayaramTerriFiezSchoolofEECSDepartmentofECE
SiliconLaboratoriesInc.WashingtonStateUniversityOregonStateUniversityAustin,TX78735,USAPullman,WA99164,USACorvallis,OR97331,USA
AnilSamavedam
Abstract—Ascalablemacromodelforsubstratenoisecouplinginheavilydopedsubstrateshasbeendeveloped.Thismodelissimplesinceitrequiresonlyfourparameterswhichcanreadilybeextractedfromasmallnumberofdevicesimulationsormeasurements.Oncetheseparametershavebeendeterminedthemodelcanbeusedforanyspacingbetweentheinjectionandsensingcontactsandfordifferentcontactgeometries.Thescalabilityofthemodelwithseparationandwidthprovidesinsightintosubstratecouplingandoptimizationissuespriortoandduringthelayoutphase.Themodelisvalidatedfora2manda0.5mCMOSprocesswhereitisshownthatthesimplemodelpredictsthenoisecouplingaccurately.Measurementsfromachipfabricatedina0.5mCMOSprocessshowgoodagreementwiththemodel.
I.INTRODUCTION
Substratecouplinginmixed-signalCMOSICscandegradetheperformanceifitisnotwellcharacterized.Todate,modelsforsubstratecouplingareusedaspartofthe nallayoutextractionandsimulationveri cation.Severaltechniqueshavebeenpro-posedforanalyzingsubstratecouplinginintegratedcircuits[1-10].Thesubstratemodelsdevelopedarebasedon nitediffer-encemethods[7,10],boundaryelementmethods[3],andpoly-nomialcurve ttingmethods[2,6].Reduced-ordermacromodelscanalsobeobtainedusingtechniquesbasedonAWEorArnoldimethods[7,9].Thesemodelsaredif culttouseintuitivelyaspartofthedesignprocess.
Inthispaper,asubstratecouplingmacromodelisdescribedthatcanbeusedduringtheearlystagesofdesignandsimulation.Foragivenprocess,simplecurve ttingisusedtodetermineafewparametersusedinthemodel.Thismodelscaleswiththesubstratecontactseparationdistanceandtheareaoftheinjectorandsensorcontacts.Itcanalsobeusedtodeterminethesub-stratecouplingbetweentransistors.Thepaperbeginswithade-scriptionofthegeneralmodelinSectionIIforap-typesubstrate.InSectionIII,thescalingofthemodelwiththecontactsizeisdescribed.SectionIVextendsthemodeltocouplingbetweenn+-p+contacts.ExperimentalresultsarepresentedinSectionVandconclusionsarepresentedinSectionVI.
II.SUBSTRATECOUPLINGMACROMODELS
Substratecouplingmodelsarenecessarytoaccuratelypredictthecouplingbetweencircuitssharingthesamesubstrate.Asub-ThisworkissupportedinpartbytheNSFCenterfortheDesignofAnalog/DigitalIntegratedCircuits(CDADIC)andunderNSFcontractCCR-9702292.
0-7803-5832-X /99/$10.00 ©1999 IEEE.
stratemacromodelwhichscalesdirectlywiththeseparation,sizeandshapeofthecontactsonadiecanbeusedtogenerateanetlist leforacircuitsimulatorgiventhelayoutandprocessinforma-tionasshowninFig.1.Suchamodelcanofferinsightintothedependenceofcouplingonsizes,shapesandplacementofdiffer-entstructuresonthedieandcancutdownontheoveralldesigntime.Further,suchmodelscanbeusedtooptimizetheplacementofstructuresforimprovedisolation.
Fig.1.Generationofascalablesubstratemacromodelfromlayouttobeusedinacircuitsimulator.
ForfrequenciesofafewGHzandbelow,thesubstratecanbetreatedasaresistivenetwork[7].InFig.2(a),thecrosssectionofatypicalheavilydopedsubstrateisshown.ThisstructurecanbesimulatedusingthedevicesimulatorTMA-Medici[11]tode-terminethecouplingbetweenpointsAandB.Thecouplingischaracterizedintermsof-parameterswherebyanACvoltageisappliedatoneportandthecurrentsaremeasuredwiththeotherportconnectedtoground.
SimulationswithMedicivalidatethatbelow2GHz,theheavily-dopedsubstratecanbemodeledasalumpedresistivenetwork.Simulationsalsoshowthatforcontactspacingsoflessthan10m,nearlyallthecurrent owsonthesurfacebetweenthetwocontacts.However,foracontactspacinggreaterthan100m,nearlyallthecurrent owsdownintothe(verylowre-sistive)substrate.ThisisillustratedinFig.2(b)wherethecurrentisshownto owdownintothesubstrate.
Themacromodelforthesubstratefortwopointcontactson
thesubstrateisshowninFig.3(a).Here
,andaretheconductances.Thebackplanecontactofthesubstrateiscon-nectedtoground.Ifthecontactsareofthesamesizeandshape
then
.ThetwoportY-parametersforthesubstratemacromodelarethengivenby,
(1)
Abstract—A scalable macromodel for substrate noise coupling in heavily doped substrates has been developed. This model is simple since it requires only four parameters which can readily be extracted from a small number of device simulations or measurement
Sensor
5u
(a)(b)
Fig.2.(a)CrosssectionofaheavilydopedCMOSsubstratewithpointcontactsand(b)current owlinesfromdevicesimulationsfor100mseparationbetweentheinjectionandsensorcontacts.
(a)(b)
Fig.3.(a)Macromodelforthesubstratewhenthebackplaneisgrounded.(b)ModelfornoisecouplingbetweenaN-sourceandP-sensor.
TheZ-parameterscanbecomputedbyinvertingtheY-matrixandaregivenby:
(2)
whereisthedeterminantofthetwo-portY-matrixandisgiven
by:
(3)
Solvingfor
(4)
whereisaconstant[6].Rearrangingthisexpression:
(5)
Ifeither
orisgivenasafunctionofdistance,theothercanbeobtainedbysolvingtheaboveequation.Fromdevicesim-ulations,increasingthespacingbetweencontactsincreases(de-creases)thevalueof
().Theactualvaluesofandcanbedeterminedfrom2-Ddevicesimulationsormeasurements.
Thevalueof
determinedfromMedicisimulationsasafunc-tionofcontactspacingisshowninFig.4(a)fora0.5manda2mCMOSprocess,respectively.Thelineardependenceonthe
semilogplotof
canbemodeledbyanexponentialdependenceon:
(6)
whereandareconstantsdeterminedfromsimulatedormea-sureddata.Onlytwopointsareneededtoobtainrelativelyaccu-rateresults.Theaccuracyofandcanbeimprovedwithmore
(a)
(b)
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