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MF70-1400中文资料

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导读: MF70 MF70 Fast Recovery DiodeReplaces March 1998 version, DS4195-2.1 DS1955-3.0 January 2000 APPLICATIONS sInverse Parallel Or Series Connected DiodesPower Supplies sHigh Frequency Applications KEY PARAMETERSVRRM1600VIF(AV)70AIFSM700AQr26C

MF70

MF70

Fast Recovery DiodeReplaces March 1998 version, DS4195-2.1

DS1955-3.0 January 2000

APPLICATIONS

sInverse Parallel Or Series Connected DiodesPower Supplies

sHigh Frequency Applications

KEY PARAMETERSVRRM1600VIF(AV)70AIFSM700AQr26µCtrr915ns

FEATURES

s Glass Passivation

s Fast Recovery Characteristicss High Voltage Capabilities

VOLTAGE RATINGS

Type Number

Repetitive PeakReverse Voltage

VRRMV

160014001200

Conditions

MF70-1600MF70-1400MF70-1200

VRSM = VRRM + 100V

Lower voltage grades available.

For stud anode add suffix 'R' to type number.Outline type code: DO5.

See Package Details for further information.

CURRENT RATINGS

SymbolIF(AV)IF(RMS)IF

Parameter

Mean forward currentRMS value

Continuous (direct) forward current

Conditions

Half wave resistive load, Tcase = 75oCTcase = 75oCTcase = 75oC

Max.7011090

UnitsAAA

1/8

MF70

SURGE RATINGS

SymbolIFSMI2t

Parameter

Surge (non-repetitive) forward currentI2t for fusing

Conditions

10ms half sine; with 100% VRRM, Tj = 125oC10ms half sine; Tj = 125oC

Max.7002450

UnitsAA2s

THERMAL AND MECHANICAL DATA

SymbolRth(j-c)Rth(c-h)

Parameter

Thermal resistance - junction to caseThermal resistance - case to heatsink

dc

Mounting torque 3.5Nmwith mounting compoundForward (conducting)

TvjTstg-Virtual junction temperature

Reverse (blocking)

Storage temperature rangeMounting torque

Use torque wrench

--553.2

1251253.8

o

ConditionsMin.---

Max.0.370.2125

Units

o

C/W

o

C/W

o

CC

CNm

CHARACTERISTICS

SymbolVFMIRMtrrQrtrrVTOrTVFRM

Forward voltagePeak reverse currentReverse recovery timeRecovered chargeReverse recovery timeThreshold voltageSlope resistanceForward recovery voltage

Parameter

Conditions

At 210A peak, Tcase = 25oCAt VRRM, Tcase = 100oCIF = 1A, diRR/dt = 25A/µsTcase = 25oC, VR = 100VIF = 100A, diRR/dt = 100A/µsTcase = 25oC, VR = 100VAt Tvj = 125oCAt Tvj = 125oC

di/dt = 1000A/µs, Tj = 125oC

Typ.-------80

Max.2.010300269151.33.34-UnitsVmA

ns

µCnsVm V

2/8

MF70

CURVES

Fig.2 Forward recovery voltage vs rate of rise of

forward voltage

Fig.1 Maximum (limit) forward characteristics

0.5

Thermal impedance - C/W

0.4

d.c.

0.3

0.2

0.1

00.001

0.01

0.1Time - (s)

1.010

Fig.3 Maximum transient thermal impedance - junction to case

3/8

MF70

Fig.4 Recovery time vs dIR/dt

Fig.6 Frequency curves - square waveform

4/8

MF70

5/8

MF70

6/8

MF70

PACKAGE DETAILS

For further package information, please contact your local Customer Service Centre. All dimensions in mm, unless statedotherwise. DO NOT SCALE.

ASSOCIATED PUBLICATIONS

Title

Calculating the junction temperature or power semiconductorsThyristor and diode measurement with a multi-meterUse of V, r on-state characteristic

TO

T

Application Note

NumberAN4506AN4853AN5001

7/8

MF70

POWER ASSEMBLY CAPABILITY

The Power Assembly group was set up to provide a support service for those customers requiring more than the basic semiconduc-tor, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage andcurrent capability of our semiconductors.

We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. TheAssembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs ofour customers.

Using the up to date CAD methods our team of design and applications engineers aim to provide the Power Assembly Completesolution (PACs).

HEATSINKS

Power Assembly has it’s own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the

performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available onrequest.

For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or thefactory.

http://www.77cn.com.cn

e-mail: power_solutions@http://www.77cn.com.cn

HEADQUARTERS OPERATIONSDYNEX SEMICONDUCTOR LTDDoddington Road, Lincoln.

Lincolnshire. LN6 3LF. United Kingdom.Tel: 00-44-(0)1522-500500Fax: 00-44-(0)1522-500550DYNEX POWER INC.Unit 7 - 58 Antares Drive,

Nepean, Ontario, Canada K2E 7W6.Tel: 613.723.7035Fax: 613.723.1518

Toll Free: 1.888.33.DYNEX (39639)

CUSTOMER SERVICE CENTRES

France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50North America Tel: 011-800-5554-5554. Fax: 011-800-5444-5444

UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020SALES OFFICES

France, Benelux, Italy and Spain Tel: +33 (0)1 69 18 90 00. Fax: +33 (0)1 64 46 54 50Germany Tel: 07351 827723

North America Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /Tel: (831) 440-1988. Fax: (831) 440-1989 / Tel: (949) 733-3005. Fax: (949) 733-2986.

UK, Germany, Scandinavia & Rest Of World Tel: +44 (0)1522 500500. Fax: +44 (0)1522 500020These offices are supported by Representatives and Distributors in many countries world-wide.© Dynex Semiconductor 2000 Publication No. DS4195-3 Issue No. 3.0 January 2000

TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRINTED IN UNITED KINGDOM

Datasheet Annotations:

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