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HSMZ-A100-S80J1中文资料(2)

来源:网络收集 时间:2026-01-03
导读: Luminous Efficacy ηv[3] (lm/W) Typ. 120 155 240 26 80 20 520 480 500 590 560 650 610 500 00 65 Luminous Intensity/ Total Flux Iv(mcd)/Φv(mlm) Typ.0.450.450.450.450.450.450.450.450.450.450.450.450.4

Luminous Efficacy ηv[3] (lm/W) Typ. 120 155 240 26 80 20 520 480 500 590 560 650 610 500 00 65 Luminous Intensity/ Total Flux

Iv(mcd)/Φv(mlm) Typ.0.450.450.450.450.450.450.450.450.450.450.450.450.450.450.450.45 Notes:

1. The dominant wavelength, λD, is derived from the CIE Chromaticity Diagram and represents the color of the device.2. θ1/2 is the off-axis angle where the luminous intensity is 1/2 the peak intensity.

. Radiant intensity, Ie in watts/steradian, may be calculated from the equation Ie = Iv/ηv, where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt.

Electrical Characteristics (TA = 25 C)

Part Number HSMS/D/Y/G HSMH HSMC/J/L/A/E HSMZ/V/U HSMB HSMM/K/N

Forward Voltage Reverse Voltage Reverse Voltage VF (Volts) @ IF = 20 mA VR @ 100 µA Typ. Max. Min. 2.2 1.9 1.9 2.2 .9 .4

2.6 2.6 2.4 2.6 4. 4.05

5 5 5 5 — —

Thermal

VR @ 10 µA Min. — — — — 5 5

Resistance RθJP (°C/W)180180280280280280

35 FORWARD CURRENT – mA

302520

151050

FORWARD VOLTAGE – V

Figure 2. Forward current vs. forward voltage.

Figure 1. Relative intensity vs. wavelength.

Figure 3. Relative intensity vs. forward current.

35302520151035

540 DOMINANT WAVELENGTH – nm

530520510500490480470460

TEMPERATURE (°C)

30

CURRENT - m

A

CURRENT - mA

2520151050

TEMPERATURE (°C)

CURRENT – mA

Figure 4. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 110 C, RθJA

= 500 C/W.

Figure 4b. Maximum Forward Current Vs. Solder Point Temperature. Derated based on TJMAX = 110°C, RθJP

= 180°C/W or 280°C/W.

current – InGaN devices.

HSMx-A100 fig 5

0.5DELTA VF (NORMALIZED AT 25°C)

0.40.30.20.10-0.1-0.2-0.3

TEMPERATURE – °C

Figure 6. Forward voltage shift vs. temperature.

TEMPERATURE

TIME

(Acc. to J-STD-020C)

Figure 8a. Recommended SnPb reflow soldering profile.

Figure 8b. Recommended Pb-free reflow soldering profile.

TEMPERATURE – °C

Figure 11. Tape leader and trailer dimensions.

Figure 13. Reel dimensions.

元器件交易网

Intensity Bin Select (X5X6)

Individual reel will contain parts from one half bin only.X5 Min Iv BinX60 Full Distribution

half bins starting from X514 4 half bins starting from X515 5 half bins starting from X517 half bins starting from X528 4 half bins starting from X52

Intensity Bin LimitsBin ID Min. (mcd) Max. (mcd)

G1 1.80 2.24G2 2.24 2.80H1 2.80 .55H2 .55 4.50J1 4.50 5.60J2 5.60 7.20K1 7.20 9.00K2 9.00 11.20L1 11.20 14.00L2 14.00 18.00M1 18.00 22.40M2 22.40 28.50N1 28.50 5.50N2 5.50 45.00P1 45.00 56.00P2 56.00 71.50Q1 71.50 90.00Q2 90.00 112.50R1 112.50 140.00R2 140.00 180.00S1 180.00 224.00S2 224.00 285.00T1 285.00 55.00T2 55.00 450.00U1 450.00 560.00U2 560.00 715.00V1 715.00 900.00Tolerance of each bin limit = ± 12%.

Color Bin Select (X7)

Individual reel will contain parts from one full bin only.X70 Full DistributionZ A and B onlyY B and C onlyW C and D onlyV D and E onlyU E and F onlyT F and G onlyS G and H onlyQ A, B, and C onlyP B, C, and D onlyN C, D, and E onlyM D, E, and F onlyL E, F, and G onlyK F, G, and H only1 A, B, C, and D only2 E, F, G, and H only B, C, D, and E only4 C, D, E, and F only5 A, B, C, D, and E only

Color Bin LimitsBlue Min. (nm) Max. (nm)

A 460.0 465.0B 465.0 470.0C 470.0 475.0

Cyan Min. (nm) Max. (nm)A 490.0 495.0B 495.0 500.0C 500.0 505.0D 505.0

510.0

Green Min. (nm) Max. (nm)A 515.0 520.0B 520.0 525.0C 525.0 5 0.0D 5 0.0 5 5.0

Color Bin Limits

Emerald

Green Min. (nm) Max. (nm)A 552.5 555.5B 555.5 558.5C 558.5 561.5D 561.5 564.5 Yellow

Green Min. (nm) Max. (nm)E 564.5 567.5F 567.5 570.5G 570.5 57 .5H 57 .5

576.5

Amber Min. (nm) Max. (nm)A 582.0 584.5B 584.5 587.0C 587.0 589.5D 589.5 592.0E 592.0 594.5F 594.5 597.0 Orange Min. (nm) Max. (nm)A 597.0 600.0B 600.0 60 .0C 60 .0 606.0D 606.0 609.0E 609.0 612.0 Red Orange Min. (nm) Max. (nm)A 611.0 616.0B 616.0

620.0

Red Min. (nm) Max. (nm)

Tolerance of each bin limit = ± 1 nm.

元器件交易网

Packaging Option (X8X9)Option Test Current J1 20 mA J4 20 mA H1 20 mA H4 20 mA J2 10 mA J5 10 mA H2 10 mA H5 10 mA

Moisture Sensitivity

Package Type Top Mount Top Mount Reverse Mount Reverse Mount Top Mount Top Mount Reverse Mount Reverse Mount

Reel Size7 inch1 inch7 inch1 inch7 inch1 inch7 inch1 inch

This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5 05 Handling of Moisture Sensitive Surface Mount Devices for details.

A. Storage before use

- Unopen moisture barrier bag (MBB) can be stored at <40°C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating.- It is not recommended to open the MBB prior to assembly (e.g. for IQC).

B. Control after opening the MBB

- The humidity indicator card (HIC) shall be read im-mediately upon opening of MBB.- The LEDs must be kept at < 0°C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours.

C. Control for unfinished reel

- For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH.

D. Control of assembled boards

- If the PCB soldered with the LEDs is to be subjected to other high tem …… 此处隐藏:4033字,全部文档内容请下载后查看。喜欢就下载吧 ……

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