电铸Ni_SiC金属基复合材料的抗拉强度与微观结构分析(2)

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图5　Ni2SiC复合材料的断口形貌

Fig.5　Themicrographoffracturesurfaceof

Ni2SiCcomposites

　　Ni2SiC拉伸试样断口形成是在SiC微粒与基体的界面处萌生裂纹、形成显微空洞及其扩展聚集直至断裂的过程.在外加载荷作用下,脆性的颗粒与韧性基体变形不协调,两者之间产生较大的内应力.随着应力或应变增加,内应力更大,为松弛内应力就会产生颗粒和界面脱粘或颗粒断裂.如果微粒和基体界面结合较强,应力能够有效地从基体转移到颗粒上,当颗粒承受的应力达到断裂强度时发生断裂;如果界面结合较弱,界面应力很容易使颗粒与基体

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上　海　交　通　大　学　学　报

第40卷　

　　由图5可以很容易识别两个噪声源的位置间距1m.三维图中的两个声源的峰值和A计权声压测

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的布置方式,结合波叠加算法取得了很好的识别效果.

4　结　语

将波叠加方法引入了噪声源识别领域,结合基于传声器阵列的测量技术和可视化的结果表示方法,提出了一种新的噪声源识别方法,并通过仿真和实验验证了该方法的正确性.仿真和实验研究都取得了良好的分辨效果,物体进行噪声源识别..的研究、、重建算法、可视化表示技术),系统.参考文献:

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