Conformal photo–resist coating technique in the through–si

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Int. J. Nanomanufacturing, Vol. 9, No. 2, 2013

Conformal photo-resist coating technique in the

through-silicon via of the semiconductor devices with the rotary atomising aerosol spray

Yoshiyuki Seike*

Technology Coordination Department, Asahi Sunac Corporation,

5050, Asahimae-cho, Owariasahi, Aichi pref., 488-8688, Japan E-mail: seike@sunac.co.jp *Corresponding author

Masanori Ohtsubo

Art Science and Technology Center for Cooperative Research, Collaborative Research Division, Kyushu University,

6-1, Kasuga Park, Kasuga,

Fukuoka pref., 816-8580, Japan

E-mail: ohtsubo@astec.kyushu-u.ac.jp

Futoshi Shimai and Kenji Maruyama

Equipment Marketing Section, Marketing Division, Tokyo Ouka Kogyo,

150, Nakamaruko, Nakahara-ku, Kawasaki, Kanagawa pref., 211-0012, Japan E-mail: f-shimai@tok.co.jp E-mail: k-maruyama@tok.co.jp

Hiroyuki Akenaga and Yoshinori Kobayashi

NC Technical Center, New Component Div., Asahi Sunac Corporation,

5050, Asahimae-cho, Owariasahi, Aichi pref., 488-8688, Japan E-mail: akenaga@sunac.co.jp E-mail: kobayashi@sunac.co.jp

Copyright © 2013 Inderscience Enterprises Ltd.

Conformal photo-resist coating technique in the through-silicon via

179

Keiji Miyachi

New Component Div., Asahi Sunac Corporation,

5050, Asahimae-cho, Owariasahi, Aichi pref., 488-8688, Japan E-mail: miyachi@sunac.co.jp

Masahiko Amari

Asahi Sunac Corporation,

5050, Asahimae-cho, Owariasahi, Aichi pref., 488-8688, Japan E-mail: Amari@sunac.co.jp

Toshiro Doi

Art Science and Technology Center for Cooperative Research, Collaborative Research Division, Kyushu University,

6-1, Kasuga Park, Kasuga,

Fukuoka pref., 816-8580, Japan E-mail: doi@astec.kyushu-u.ac.jp

Syuhei Kurokawa

Department of Mechanical Engineering, Faculty of Engineering, Kyushu University,

744 Motooka, Nichi-ku, Fukuoka, Fukuoka pref., 819-0395, Japan

E-mail: kurobe-@mech.kyushu-u.ac.jp

Abstract: Semiconductor devices are increasingly sophisticated in their application of three-dimensional laminated chips inside through-silicon via (TSV). TSV is a technology that connects the stacked chips using through electrodes instead of higher integrated circuits densities. In this report, we invented a new photo-resist coating method inside the TSV using the rotary atomising aerosol spray. We measured the characteristics of the flying droplets from the atomising aerosol spray nozzle by a shadow Doppler particle analyser (SDPA) to indicate that the new method is capable of coating the photo-resist inside the TSV. Furthermore, we tried to make the prototype coating system with the rotary atomising aerosol spray nozzle and run the experiments in to coat the photo-resist inside the TSV test element group (TEG) wafer. Results indicate that the photo-resist is coated on the TSV TEG wafer having opening diameter of 50 μm to 200 μm, depth of 50 μm and square pyramid via holes with tapered angle of 54.7 degrees by using the prototype equipment. It is confirmed that coating along the inner walls of via holes is feasible.

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Keywords: through-silicon via; TSV; 3D stack semiconductor device; rotary atomising aerosol spray; photoresist coating; flying droplets; shadow Doppler particle analyser; SDPA; resist thickness; film thickness; photo-resist; conformal resist coating.

Reference to this paper should be made as follows: Seike, Y., Ohtsubo, M., Shimai, F., Maruyama, K., Akenaga, H., Kobayashi, Y., Miyachi, K., Amari, M., Doi, T. and Kurokawa, S. (2013) ‘Conformal photo-resist coating technique in the through-silicon via of the semiconductor devices with the rotary atomising aerosol spray’, Int. J. Nanomanufacturing, Vol. 9, No. 2, pp.178–193.

Biographical notes: Yoshiyuki Seike is a Manager of Technology Coordination Department and Quality Assurance Department at Asahi Sunac Corporation. He engages in the research and development of the semiconductor production machine. He earned his PhD in Mathematics Electronics and Informatics from Saitama University, Japan and is focused on the surface conditioning technology in the electrical devices.

Masanori Ohtsubo is a Technical Staff in the Art Science and Technology Center for Cooperative Research Division (KASTEC); realm of optoelectronics functional materials, at Kyushu University. His current research is focused on the high efficiency polishing process for the wide-gap semiconductor substrates such as SiC, etc. He was educated at Virginia Polytechnic Institute and State University, USA.

Futoshi Shimai is a Manager of Equipment Section in the Marketing Division at Tokyo Ohka Kogyo Co., LTD. He engages in the development of the semiconductor production machine and the research of the process semiconductor devices.

Kenji Maruyama is a Manager of Equipment Section in the Marketing Division at Tokyo Ohka Kogyo Co., LTD. He engages in the development of the semiconductor production machine and the research of the process semiconductor devices.

Hiroyuki Akenaga is an Engineer of New Components Technology Center in the New Component Division at Asahi Sunac Corporation. He engages in the research of the semiconductor production process. He was educated in the Materials Science at Kitami Institute of Technology, Japan.

Yoshinori Kobayashi is a Manager of New Components Technology Center in the New Component Division at Asahi Sunac Corporation. He engages in the research of the semiconductor production process. He was educated in the Department of Mechanical Engineering at Nagoya Institute of Technology, Japan.

Keiji Miyachi is the Division Director in the New Component Division at Asahi Sunac Corporation. He engages in the management of the st …… 此处隐藏：28583字，全部文档内容请下载后查看。喜欢就下载吧 ……