DELO-AC265 ACP adhesive datasheet

用于RFID标签芯片邦定的Delo AC265各向异性导电胶水的数据

DELO-MONOPOX® AC265

Anisotropic conductive, heat-curing adhesive to contact flip chip (e. g. with Ni/Au- and galvanic Au-bumps)

- modified epoxy resin

- one-part, heat curing, solvent-free, not filled

- especially suitable for smart label and smart card

- fast curing at moderate temperatures (+150 to +210 °C at the adhesive)

- high reliability at the test +85 °C / 85 % relative humidity by the low water absorbtion - very good adhesion on PET, FR 4, copper, aluminium and silver

- for bonding and electrical contacting of uncased semiconductors (ICs) in the Flip-Chip technology

- the adhesive is ready-for-use on delivery, processing time at room temperature is 2 weeks - the adhesive will be applied through dispensing or stencil printing - the process steps for the adhesive application are as follows:

- 1. Application of adhesive to the substrate. It must be ensured that the adhesive layer has no bubbles.

- 2. Placing the semiconductor into the adhesive.

- 3. At a temperature of +150 to +210 °C at the adhesive, press the semiconductor with a thermode and a defined pressure.

- 4. By specifically high demands, a post-curing of 2 min at +140 °C is recommended.

- the surface areas which are to be bonded must be dry, free of dust and grease as well as of other contaminants

- the curing process needs e. g. 6 to 19 seconds at +150 to +210 °C at the adhesive using a thermode

- higher temperatures decrease, lower temperatures prolong the curing process and may possibly change the properties of the cured product - the minimum curing temperature is +120 °C

- the actual curing times at respective temperatures are dependent on the time it takes to heat-up the join parts, the heating time of the components must be added to the curing time of the adhesive

- for curing times at recommended temperatures, see the technical data

Color

cured

greyish-brownish NiAu-particles

particle type and surface

用于RFID标签芯片邦定的Delo AC265各向异性导电胶水的数据

particle size [µm]

approx. 2.5 1.3

Density [g/cm³]

standard DELO 13

at room temperature (approx. 23 °C)

Viscosity [mPas]

at 23 °C, rheometer, shear rate 10 1/s

26000 6 50 1.7 3300 135 61 180 0.4 < 10 < 10 < 10 < 10 2 weeks 6 months

pressing time [s]

at +210 °C adhesive temperature

tensile strength [MPa]

DIN EN ISO 527

elongation at tear [%]

DIN EN ISO 527

Young modulus [MPa]

DIN EN ISO 527

glass transition temperature [°C]

rheometer

coefficient of elongation [ppm/K]

TMA, in a temperature range of +30 to +100 °C

coefficient of elongation [ppm/K]

TMA, in a temperature range of +130 to +160 °C

water absorption [weight %]

corresponding to DIN EN ISO 62, 24 h at room temperature (approx. 23 °C)

ion content Na+ [ppm]

extraction

ion content K+ [ppm]

extraction

ion content Cl- [ppm]

extraction

ion content F- [ppm]

extraction

Storage life

at room temperature (approx. 23 °C) in unopened original container

storage life at ≤ +8 °C

in unopened original container

General

The data and information provided are based on tests performed under laboratory conditions. Reliable information about the behaviour of the product under practical conditions and its suitability for a specific purpose cannot be concluded from this.

It is the user’s responsibility to test the suitability of the product for the intended purpose by considering all specific requirements. Type and physical and chemical properties of the materials to be processed with the product, as well as all actual influences occurring during transport, storage, processing and use, may cause deviations in the behaviour of the product compared to its behaviour under laboratory conditions. All data provided are typical average values or uniquely determined parameters measured under laboratory conditions.

The data and information provided are therefore no guarantee for specific product properties or the suitability of the product for a specific purpose.

Instructions for use

The instruction for use is available under following address: www.DELO.de. If requested we will also be pleased to send it to you.

Occupational health and safety

see material safety data sheet

用于RFID标签芯片邦定的Delo AC265各向异性导电胶水的数据

Specification

see quality assurance test report