emmc_v451_153b_4gb 8gb_pb——MTFC4GMCDM-1M WT

e·MMC? Memory

MTFC4GMCDM-1M WT, MTFC8GLCDM-1M WT Features

?MultiMediaCard (MMC) controller and NAND Flash ?153-ball TFBGA

(RoHS compliant, "green package")?V CC : 2.7–3.6V

?V CCQ (dual voltage): 1.65–1.95V; 2.7–3.6V ?Temperature ranges

–Operating temperature: –25?C to +85?C –Storage temperature: –40?C to +85?C

MMC-Specific Features

?JEDEC/MMC standard version 4.51-compliant (JEDEC Standard No. 84-B451) – SPI mode not supported (see 856120c5866fb84ae45c8de2/sites/default/files/docs/JESD84-B451.pdf)

–Advanced 11-signal interface

–x1, x4, and x8 I/Os, selectable by host

–SDR/DDR modes up to 52 MHz clock speed –HS200 mode

–Command classes: class 0 (basic); class 2 (block read); class 4 (block write); class 5 (erase);class 6 (write protection); class 7 (lock card)–Temporary write protection

–Boot operation (high-speed boot)–Sleep mode

–Replay-protected memory block (RPMB)–Secure erase and secure trim –Hardware reset signal

–Multiple partitions with enhanced attribute –Permanent and power-on write protection –High-priority interrupt (HPI)

Figure 1: Micron e ·MMC Device

MMC-Specific Features (Continued)–Background operation –Reliable write

–Discard and sanitize –Extended partitioning –Context ID –Data TAG

–Packed commands

–Backward compatible with previous MMC ?ECC and block management implemented

Micron Confidential and Proprietary

4GB, 8GB: e·MMC

Features

PDF: 09005aef85210ae5

emmc_v451_153b_4gb-8gb_pb.pdf - Rev. H 06/14 EN 1

Micron Technology, Inc. reserves the right to change products or specifications without notice.

? 2013 Micron Technology, Inc. All rights reserved.

Products and specifications discussed herein are subject to change by Micron without notice.

e ·MMC Performance and Current Consumption

Table 1: MLC Partition Performance

Note:

1.Bus in x8 I/O mode. Sequential access of 1MB chunk; random access of 4KB chunk over 1GB span. Additional

performance data, such as system performance on a specific application board, will be provided in a sepa-rate document upon customer request.

Table 2: Current Consumption

Note:

1.Bus in x8 I/O mode; 25°C; V CCQ = 1.95V. Measurements done as average RMS current consumption.

Micron Confidential and Proprietary

4GB, 8GB: e·MMC

Features

PDF: 09005aef85210ae5

emmc_v451_153b_4gb-8gb_pb.pdf - Rev. H 06/14 EN 2Micron Technology, Inc. reserves the right to change products or specifications without notice.

? 2013 Micron Technology, Inc. All rights reserved.

Part Numbering Information

Micron ? e ·MMC memory devices are available in different configurations and densities.Figure 2: e ·MMC Part Numbering

MT FC xx

x

x xx xx -x

ES

Micron Technology

FC = NAND Flash + Controller NAND Flash Density

NAND Flash Component Controller ID Package Codes

Design Revision Production Status

Wafer Process Applied

Operating Temperature Range Special Options

xx

Table 3: Ordering Information

Device Marking

Due to the size of the package, the Micron-standard part number is not printed on the top of the device. Instead,an abbreviated device mark consisting of a 5-digit alphanumeric code is used. The abbreviated device marks are cross-referenced to the Micron part numbers at the FBGA Part Marking Decoder site: 856120c5866fb84ae45c8de2/decoder.

Micron Confidential and Proprietary

4GB, 8GB: e·MMC

Features

PDF: 09005aef85210ae5

emmc_v451_153b_4gb-8gb_pb.pdf - Rev. H 06/14 EN 3Micron Technology, Inc. reserves the right to change products or specifications without notice.

? 2013 Micron Technology, Inc. All rights reserved.

General Description

Micron e ·MMC is a communication and mass data storage device that includes a Multi-MediaCard (MMC) interface, a NAND Flash component, and a controller on an ad-vanced 11-signal bus, which is compliant with the MMC system specification. Its low cost, small size, Flash technology independence, and high data throughput make

e ·MMC ideal for smartphones, digital cameras, PDAs, MP3s, and other portable applica-tions.

The nonvolatile e ·MMC draws no power to maintain stored data, delivers high perform-ance across a wide range of operating temperatures, and resists shock and vibration dis-ruption.Micron Confidential and Proprietary

4GB, 8GB: e·MMC General Description

PDF: 09005aef85210ae5

emmc_v451_153b_4gb-8gb_pb.pdf - Rev. H 06/14 EN 4Micron Technology, Inc. reserves the right to change products or specifications without notice.? 2013 Micron Technology, Inc. All rights reserved.

Signal Descriptions

Table 4: Signal Descriptions

Note: 1.V SS and V SSQ are connected internally.Micron Confidential and Proprietary

4GB, 8GB: e·MMC Signal Descriptions

PDF: 09005aef85210ae5

emmc_v451_153b_4gb-8gb_pb.pdf - Rev. H 06/14 EN 5Micron Technology, Inc. reserves the right to change products or specifications without notice.? 2013 Micron Technology, Inc. All rights reserved.

153-Ball Signal Assignments

Figure 3: 153 Ball (Top View, Ball Down)

A B C D E F G H J K L M N P

1

2

3

4

5

6

7

8

9

10

11

12

13

14

Notes:

1.Some previous versions of the JEDEC product or mechanical specification had defined

reserved for future use (RFU) balls as no connect (NC) balls. NC balls assigned in the pre-vious specifications could have been connected to ground on the system board. To ena-ble new feature introduction, some of these balls are assigned as RFU in the v4.4 me- …… 此处隐藏：15222字，全部文档内容请下载后查看。喜欢就下载吧 ……