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EN71PL032A0-70CWP中文资料

来源:网络收集 时间:2026-08-08
导读: 元器件交易网http://www.77cn.com.cn Distinctive Characteristics MCP Features ■ Power supply voltage of 2.7 V to 3.3V ■ High performance - 70 ns ■ Package - 7 x 9 x 1.2mm 56 ball FBGA ■ Operating Temperature - 25C to +85C General Descrip

元器件交易网http://www.77cn.com.cn

Distinctive Characteristics

MCP Features

■ Power supply voltage of 2.7 V to 3.3V ■ High performance - 70 ns ■ Package

- 7 x 9 x 1.2mm 56 ball FBGA

■ Operating Temperature - 25°C to +85°C

General Description

The EN71PL series is a product line of stacked Multi-Chip Product (MCP) packages and consists of: EN29PL032 (Simultaneous Read/Write) Flash memory die. ■ Pseudo SRAM.

For detailed specifications, please refer to the inpidual datasheets listed in the following table.

Device Document NOR Flash Pseudo SRAM

EN29PL032 EN_EM1

Product Selector Guide

32Mb Flash Memory

Device-Model# EN71PL032A0

Flash Access time (ns)

70

pSRAM density 16M pSRAM

pSRAM Access time (ns)

70

Package 56 FBGA

MCP Block Diagram

Connection Diagram

MCP EN71PL032A0

Flash-only Addresses

A20

Shared Addresses

A19 – A0

Pin Description

A20–A0 DQ15–DQ0 CE1#f CE1#ps CE2ps OE# WE# RY/BY# UB# LB# RESET# WP#/ACC VCCf VCCps VSS NC

21 Address Inputs (Common) 16 Data Inputs/Outputs (Common) Chip Enable 1 (Flash) Chip Enable 1 (pSRAM) Chip Enable 2 (pSRAM) Output Enable (Common) Write Enable (Common) Ready/Busy Output (Flash) Upper Byte Control (pSRAM) Lower Byte Control (pSRAM)

Hardware Reset Pin, Active Low (Flash) Hardware Write Protect/Acceleration Pin (Flash) Flash 3.0 volt-only single power supply pSRAM Power Supply Device Ground (Common) Pin Not Connected Internally

Logic Symbol

ORDERING INFORMATION

EN71PL032 A0 ― 70 C W P

PACKAGING CONTENT

(Blank) = Conventional P = Pb Free

TEMPERATURE RANGE

W = Wireless (-25°C to +85°C)

PACKAGE

C =56-Ball Fine Pitch Ball Grid Array (FBGA) 0.80mm pitch, 7mm x 9mm package SPEED

70 = 70ns

pSRAM density

A0 = 16M pSRAM

BASE PART NUMBER

EN = Eon Silicon Solution Inc.

71PL = Multi-chip Product (MCP)

3.0V Simultaneous Read/Write, Page Mode Flash Memory and RAM

032 = 32 Megabit (2M x 16)

PACKAGE MECHANICAL

56-ball Fine-Pitch Ball Grid Array (FBGA) 7 x 9 mm Package

Revisions List

Revision No A B

Description

Date

Initial Release 2008/04/08 page 4.

2008/09/10

2. Remove the inpidual datasheet descriptions of

EN29PL064/032 and EN_EM566168GD from Vision A.

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