SSC-MGT661中文资料

元器件交易网http://doc.guandang.net

*Customer:

SPECIFICATIONITEM MODEL TOP LED DEVICE SSC-MGT722

[Contents]

1. Features

------------------------------------------------------------- 2

2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. Rank of MGT722 6. Soldering Profile 8. Packing -----------------------------------------4 ---------------------------------------------------- 5 -------------------------------------- 6 7 9

7. Outline Dimension And Material

-------------------------------------------------------------------------------------------------------------

9. Reel Packing Structure ------------------------------------------------- 8 10. Lot Number 11. Precaution for Use --------------------------------------------------- 10 12. Characteristic Diagram ---------------------------------------- 11CUSTOMER Checked by Approved by

SUPPLIER Drawn by Checked by Approved by

SSC-QP-7-03-08(REV.07)

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone: 82-2-2106-7305~6

SSC-MGT722

- 1/10 -

元器件交易网http://doc.guandang.net

1. FeaturesPb-free Reflow Soldering application RoHS Compliant Material: InGaN Suitable for all SMT assembly methods; Suitable for all soldering methods White colored SMT package and colorless clear window Encapsulating Resin: Epoxy Resin

2. ApplicationIndoor and outdoor displays LCD Backlights etc. Green– displays Automotive Signage and Channel letter Indicator

3. Absolute Maximum Ratings *1Parameter Power Dissipation Forward Current Forward Peak Surge Current (per die) Reverse Voltage (per die) Operating Temperature Storage Temperature Symbol Pd IF IFM VR Topr Tstg*2

(Ta=25ºC)

Value 369 90 100 5 -30~+85 -40~+100

Unit mW mA mA VºCºC

*1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW≤ 1msec of pulse width and D≤ 1/10 of duty ratio.

SSC-QP-7-03-08(REV.07)

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone: 82-2-2106-7305~6

SSC-MGT722

- 2/10 -

元器件交易网http://doc.guandang.net

4. Electro-Optical CharacteristicsParameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity *1 Dominant WavelengthPeak Wavelength

(Ta=25ºC)

Symbol VF IR IV

Condition IF=20 mA VR=5V IF=60 mA IF=60 mAIF=60mA

Min 2.7 519-

Typ 3.3 1800 527520

Max 4.1 10 537-

Unit VµA mcd nmnm

λdλP

Spectral Bandwidth Viewing Angle *2

λ2θ½

IF=60 mA IF=60 mA

-

20 120

-

nm deg

*1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is±10%. *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the

peak intensity.[Note] All measurements were made under the standardized environment of SSC.

SSC-QP-7-03-08(REV.07)

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone: 82-2-2106-7305~6

SSC-MGT722

- 3/10 -

元器件交易网http://doc.guandang.net

5. Rank of MGT722 Rank Name Table X1 Iv X2λd X3 Vf

Luminous Intensity[Iv] Rank Iv (mcd) Name MIN MAX N 1000 1600 O 1600 2000 P 2000 2500 Dominant Wavelength[λd] Rankλd (nm) Name MIN MAX 519 525 A 525 531 B C 531 537 Forward Voltage Rank Name 1 2 3 Vf (V) MIN 2.7 3.1 3.6 MAX 3.1 3.6 4.1

SSC-QP-7-03-08(REV.07)

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone: 82-2-2106-7305~6

SSC-MGT722

- 4/10 -

元器件交易网http://doc.guandang.net

6.Soldering Profile (1) Reflow Soldering Conditions/ Profile (Lead Free Solder)

Temp[°C]Tm: Reflow machine setting temp (max 30 sec.) Ts: Surface temp of PCB (max) Ts: Surface temp of PCB (recommend) Ts: Surface temp of PCB (min)

260 240 220 200

180 150~

Pre-heating

Rising 5°C/sec

Cooling -5°C/sec

0 Time[Hr]

(2) Hand Soldering conditionsDo not exceed 4 seconds at maximum 315ºC under soldering iron.

Note: In case that the soldered products are reused in soldering process, we don’t guarantee the products.

SSC-QP-7-03-08(REV.07)

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone: 82-2-2106-7305~6

SSC-MGT722

- 5/10 -

元器件交易网http://doc.guandang.net

7. Outline Dimension And Material

Package Outlines

6

5

4

Package Marking (Cathode)

1 2 3 Front View

Right View

Rear View

( Tolerance:±0.2,

Unit: mm )

Circuit DiagramGreen Anode6

Recommended Solder Pad

Green Anode5

Green Anode4

G11

G22

G33

Green Cathode

Green Cathode

Green Cathode

* MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy

SSC-QP-7-03-08(REV.07)

SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone: 82-2-2106-7305~6

SSC-MGT722

- 6/10 -

元器件交易网http://doc.guandang.net

元器件交易网http://doc.guandang.net

9. Reel Packing Structure

Reel

XXXQUANTITY: XXXX LOT NUMBER: XXXXXXXXXX PART NUMBER:

XXXXXX

SEOUL SEMICONDUCTOR CO., LTD.

HUMIDITY INDICATOR DESI PAK

Aluminum Vinyl Bag

XXXQUANTITY: XXXX LOT NUMBER: XXXXXXXXXX PART NUMB

ER:

XXXXXX

SEOUL SEMICOND …… 此处隐藏：6732字，全部文档内容请下载后查看。喜欢就下载吧 ……