HDSP-303E中文资料

10 mm 1 DigitSlim Font Display

Reliability Data Sheet

Agilent

HDSP-301G/HDSP-303GHDSP-301E/HDSP-303EHDSP-301Y/HDSP-303YHDSP-301A/HDSP-303A

Description

The following cumulative testresults have been obtained fromtesting performed at AgilentTechnologies OptoelectronicsDivision in accordance

with the latest revision ofMIL-STD-883.

The actual performance youobtain from Agilent parts

depends on the electrical andenvironmental characteristics ofyour application but will probablybe better than the performanceoutlined in Table 1.

Table 1. Life Tests

Demonstrated Performance

Point Typical Performance

ColorsYellow

Stress TestHigh TemperatureOperating LifeHigh TemperatureOperating LifeHigh TemperatureOperating LifeLow TemperatureOperating Life

Stress TestConditionsTA = +55°C,IF = 20 mATA = +55°C,IF = 30 mATA = +55°C,IF = 15 mATA = -40°CIF = 30 mA forHER & GreenIF = 15 mA forYellowTA = -20°C,IF = 15 mATA = +85°C,R.H. = 85%IF = 10 mA

Total

Device Hrs.10,500

UnitsTested21

UnitsFailed0

MTBF10,500

Failure Rate(% /1K Hours)< 9.52

HER,GreenAlGaAs

21,00042021,000< 4.76

10,50021010,500< 9.52

HER,

Green andYellow

31,50063031,500< 3.17

AlGaAs

Low TemperatureOperating LifeWet HighTemperatureOperating Life

10,50021010,500< 9.52

HER,Green,Yellow,AlGaAs

42,00084042,000< 2.38

Table 2. Environmental TestsTest NameSolder HeatResistance

ReferenceAgilent

Internal Test

Test Conditions

1x wave solder at 245°C for total of 3 secondsand 5 Temperature Cycles perMIL-STD-883 Method 1010.

-40°C to +80°C, 15 min. dwell, 5 min. transfer, up to 20 cycles.....................................85°C, 85% RH, 500 Hours

UnitsTested2,300

UnitsFailed0

TemperatureCycleHumidityStorage

MIL-STD-883Method 1010JIS C 7021Method B-11

2,3000

210

http://doc.guandang.netData subject to change.

Copyright © 2000 Agilent Technologies, Inc.5980-2922EN (9/00)